Taizhou issue bonds

2013-03-29

Taizhou Sanfu Ship Engineering issues bonds worth CNY 700m ($112.63m).

The Chinese shipyard's debt issue began on March 27.

China Securities play as the main underwriter.

Meanwhile, Taizhou Sanfu has provided its 50,000-dwt outfitting yard as collateral.

Source from asiasis

Source from :

HEADLINES